Method for Cleaning Hermetic Semiconductor Packages
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United States of America Patent
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Issued Date -
Feb 2, 2017
app pub date -
May 18, 2016
filing date -
Jul 28, 2015
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Abstract
A method for removing undesirable particles from a semiconductor package is disclosed. The method comprises dispensing dry ice into random cavities of the semiconductor package, and removing the undesirable particles from the random cavities using the dry ice, where the dry ice causes the undesirable particles to dislodge from the random cavities, and where the undesirable particles are removed through an exhaust system. The method further comprises placing the semiconductor package into a vacuum, dispensing nitrogen into the random cavities, and hermetically sealing the semiconductor package so as to produce a hermetic semiconductor package. At least one of the random cavities is on a surface of a semiconductor die in the semiconductor package.
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