Rotating substrate laser anneal
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United States of America Patent
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Apr 9, 2019
Grant Date -
Feb 2, 2017
app pub date -
Jul 19, 2016
filing date -
Jul 29, 2015
priority date (Note) -
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Abstract
Embodiments of the present disclosure relate to thermal processing of substrates. More specifically, embodiments described herein relate to flash on spike annealing processes and apparatus suitable for performing such processes. In one embodiment, a thermal processing apparatus may include a lamp radiation source, a laser source, and a reflector plate disposed between the lamp radiation source and the laser source. One or more apertures may be formed in the reflector plate and the laser source may be positioned adjacent to the reflector plate such that a laser beam emitted from the laser source propagates through the one or more apertures. In one embodiment, the reflector plate may be substantially circular and the one or more apertures may approximate a sector of the reflector plate.
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