Water-holding structure bonding kit
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United States of America Patent
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Nov 17, 2020
Grant Date -
Feb 2, 2017
app pub date -
Oct 17, 2016
filing date -
Oct 30, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A bonding kit for use with a water-holding structure, the kit having a bonding conductor with a body portion configured to reside within a component attached to the water-holding structure. The bonding conductor includes an extension portion configured to extend outwardly from the component. The bonding kit includes a conductor fitting configured to attach to the extension portion of the bonding conductor and to attach to a conductive system of the water-holding structure, providing an electrical connection between the bonding conductor, or water therein, and the conductive system, the bonding conductor providing equipotential bonding for water contained in the water-holding structure.
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