W-NI SPUTTERING TARGET

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United States of America Patent

SERIAL NO

15106393

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sputtering target contains 45 to 75 wt % W and a remainder of Ni and common impurities. The sputtering target contains a Ni(W) phase, a W phase and no or less than 10% intermetallic phases. A process for producing a W—Ni sputtering target and a process of using the sputtering target are also provided.

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Patent Owner(s)

Patent OwnerAddress
PLANSEE SEMETALLWERK-PLANSEE-STRASSE 71 REUTTE A-6600

International Classification(s)

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  • 2014 Application Filing Year
  • C23C Class
  • 2649 Applications Filed
  • 2034 Patents Issued To-Date
  • 76.79 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LINKE, CHRISTIAN EHENBICHL, AT 19 22
SCHERER, THOMAS LECHASCHAU, AT 68 1039

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Patent Citation Ranking

  • 1 Citation Count
  • C23C Class
  • 27.20 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4219241045322915232201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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