W-NI SPUTTERING TARGET
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United States of America Patent
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Dec 17, 2014
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Dec 20, 2013
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Abstract
A sputtering target contains 45 to 75 wt % W and a remainder of Ni and common impurities. The sputtering target contains a Ni(W) phase, a W phase and no or less than 10% intermetallic phases. A process for producing a W—Ni sputtering target and a process of using the sputtering target are also provided.
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