POLYAMIDE COMPOSITIONS FOR SEALANTS AND HIGH SOLIDS PAINTS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Feb 2, 2017
app pub date -
Jul 29, 2016
filing date -
Jul 31, 2015
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Abstract
A polyamide composition for use in sealants, adhesives and high solids coatings.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ELEMENTIS SPECIALTIES INC | 469 OLD TRENTON ROAD EAST WINDSOR NJ 08512 |
International Classification(s)

- 2016 Application Filing Year
- C09J Class
- 1319 Applications Filed
- 856 Patents Issued To-Date
- 64.90 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
CHEN, Yanhui | Princeton, US | 30 | 56 |
# of filed Patents : 30 Total Citations : 56 | |||
FEITO, Carlos | Pulheim, DE | 3 | 0 |
# of filed Patents : 3 Total Citations : 0 | |||
HECK, James | Robbinsville, US | 5 | 0 |
# of filed Patents : 5 Total Citations : 0 | |||
IJDO, Wouter | Yardley, US | 28 | 31 |
# of filed Patents : 28 Total Citations : 31 | |||
PIRON, Elke | Krefeld, DE | 3 | 0 |
# of filed Patents : 3 Total Citations : 0 |
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- C09J Class
- 0 % this patent is cited more than
- 8 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 2, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent Application No: 2018/0019,173
SEMICONDUCTOR DEVICE AND CASING OF THE SEMICONDUCTOR DEVICE
Abstract
A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.
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