Thermoelectric device cooling system
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United States of America Patent
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May 12, 2020
Grant Date -
Jan 26, 2017
app pub date -
Jan 14, 2016
filing date -
Jul 20, 2015
priority date (Note) -
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Abstract
A thermoelectric cooling system includes at least one thermoelectric cooling module and an electronic circuit. The at least one thermoelectric cooling module is arranged in at least one zone. The electronic circuit is electrically coupled to at least one of the thermoelectric cooling modules. Each of the thermoelectric cooling modules includes a first plate, a sink, a plurality of thermoelectric elements, and a second plate. The thermoelectric elements are coupled to the first plate and the second plate. The first plate is arranged to be thermally coupled to a first surface. The sink is arranged to be thermally coupled to an environment and is configured to dissipate heat by evaporating a liquid from the sink to the environment. The second plate is arranged to be thermally coupled to the sink.
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