LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20170025568A1
SERIAL NO

15066906

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Abstract

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A light emitting diode and a method of manufacturing the light emitting diode are provided. The light emitting diode includes an n-type semiconductor layer, an inclined type superlattice thin film layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer is disposed on a substrate. The inclined type superlattice thin film layer is disposed on the n-type semiconductor layer and includes a plurality of thin film pairs in which InGaN thin films and GaN thin films are sequentially stacked. The active layer having a quantum well structure is disposed on the inclined type superlattice thin film layer. The p-type semiconductor layer is disposed on the active layer. Composition ratio of Indium (In) included in the InGaN thin film is increased as getting closer to the active layer. Thus, internal residual strain is reduced, and quantum confinement effect is enhanced, and internal quantum efficiency is increased.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY300 YONGBONG-DONG BUK-GU GWANGJU 500-757

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JI, Taeksoo Seoul, KR 2 4
KIM, Wangki Gwangju, KR 2 4
LEE, Jinhong Gwangju, KR 2 4
LEE, Kwangjae Gwangju, KR 24 215
PARK, Jinyoung Gwangju, KR 79 219
SHIM, Jaesam Gwangju, KR 2 4

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