Backside Stacked Die In An Integrated Circuit (IC) Package
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United States of America Patent
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Issued Date -
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app pub date -
Jul 21, 2016
filing date -
Jul 22, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit (IC) device may include a substrate including a first mounting area and a ground ring, a first integrated circuit die attached to the first mounting area, a die attach paddle mounted onto the ground ring and extending above the first integrated circuit die, and a second integrated circuit die mounted on a second mounting area, wherein the die attach paddle defines the second mounting area above the first integrated circuit die. The second integrated circuit die may have a backside oriented toward the substrate and connected to ground.
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