STRUCTURE PROVIDED WITH CARBON FILM AND METHOD FOR FORMING CARBON FILM

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United States of America Patent

APP PUB NO 20170022607A1
SERIAL NO

15114354

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A structure in an embodiment of the present invention includes fine unevenness structure in the surface of a carbon film independently of the shape of the surface of a substrate. This structure includes a substrate and a carbon film formed on the substrate and containing carbon or carbon and hydrogen. At least part of the surface of the carbon film has fine unevenness structure formed by applying ions and/or radicals (e.g., plasma) of oxygen and/or Ar. The fine unevenness structure has a ten point average roughness Rz of 20 nm or larger.

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Patent Owner(s)

Patent OwnerAddress
TAIYO YUDEN CHEMICAL TECHNOLOGY CO LTD2947-1 KURAGANO-MACHI TAKASAKI-SHI GUNMA 370-1201

International Classification(s)

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  • 2015 Application Filing Year
  • C23C Class
  • 3009 Applications Filed
  • 2118 Patents Issued To-Date
  • 70.39 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIBUSAWA, Kunihiko 370-1201, JP 15 403

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  • 6 Citation Count
  • C23C Class
  • 27.20 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4219241045322915232201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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