CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
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United States of America Patent
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Issued Date -
Jan 19, 2017
app pub date -
Feb 23, 2016
filing date -
Jul 15, 2015
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Abstract
A circuit board includes an insulating layer, a first circuit layer that is buried in one surface of the insulating layer, a metal post located on the first circuit layer, and a barrier layer located on a portion of the interface between the first circuit layer and the metal post. Also, a method for manufacturing a circuit board includes forming a barrier layer on at least one surface of the carrier board, forming a circuit layer on the barrier layer, forming an insulating layer into which the circuit layer is buried, eliminating at least a part of the carrier board, eliminating at least a part of the barrier layer to expose a part of the circuit layer, and forming a metal post on the exposed circuit layer. Such a circuit board and method allows for a board with thinner thickness and good electrical performance.
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