METHOD OF MANUFACTURING MULTI-LAYERED FILM, AND MULTI-LAYERED FILM

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United States of America Patent

APP PUB NO 20170018702A1
SERIAL NO

15123858

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Abstract

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A method of manufacturing a multi-layered film includes: forming an electroconductive layer on a substrate; forming a seed layer including an oxidative product having a perovskite structure so as to coat the electroconductive layer by a sputtering method; and forming a dielectric layer so as to coat the seed layer.

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ULVAC INCDIYUAN 2500 MAOQI KANAGAWA JAPAN CHIGASAKI-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HENMI, Mitsunori Chigasaki-shi, JP 7 2
HIROSE, Mitsutaka Chigasaki-shi, JP 5 2
KIMURA, Isao Chigasaki-shi, JP 90 998
KOBAYASHI, Hiroki Chigasaki-shi, JP 248 1354
SUU, Koukou Chigasaki-shi, JP 55 882
TSUKAGOSHI, Kazuya Chigasaki-shi, JP 5 34

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