METHOD OF FABRICATING LIGHT PIPE OF IMAGE SENSING DEVICE
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United States of America Patent
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Issued Date -
Jan 19, 2017
app pub date -
Oct 29, 2015
filing date -
Jul 17, 2015
priority date (Note) -
Abandoned
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Abstract
A method of fabricating a light pipe of an image sensing device including following steps is provided. A substrate is provided. The substrate includes a pixel region and a periphery region. A light sensing region has been formed in the substrate. The light sensing region is located in the pixel region. A dielectric layer is formed on the substrate. An interconnection structure and a light-blocking metal layer have been formed in the dielectric layer. The light-blocking metal layer is located over the interconnection structure, and the light-blocking metal layer has an opening exposing the light sensing region. A portion of the dielectric layer exposed by the opening is removed by using the light-blocking metal layer as a mask to form the light pipe in the dielectric layer.
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