Resin Molded Product And Method For Manufacturing The Same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170015051A1
SERIAL NO

15203912

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resin molded product is configured by bonding a first resin member and a second resin member by radiation of a laser light. The first resin member has a laser light permeability to be permeable to the laser light, and the second resin member has a laser light absorbing property to absorb the laser light. The resin molded product includes a protrusion portion and a recess portion. The protrusion portion is provided in the second resin member, the protrusion portion bonded to the first resin member by melting of the protrusion portion via the radiation of the laser light. The recess portion is provided in the first or second resin member so as to be located on both sides of the protrusion portion, the recess portion accommodating at least a part of the protrusion portion melted by the radiation of the laser light.

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Patent Owner(s)

Patent OwnerAddress
HAMANAKODENSO CO LTD136 WASHIZU KOSAI-CITY SHIZUOKA-PREF 431-0431

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KURITA, Chiaki Hamamatsu-city, JP 2 4

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