HIGH EFFICIENCY SINGLE CRYSTAL SILICON SOLAR CELL WITH EPITAXIALLY DEPOSITED SILICON LAYERS WITH DEEP JUNCTION(S)

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United States of America Patent

SERIAL NO

15204979

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Abstract

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Embodiments of the present invention may include single crystal silicon solar cell structures with epitaxially deposited silicon device layers with deep junction(s). In some embodiments, the single crystal silicon solar cell structures may comprise a moderately doped, thick (greater than 10 microns), epitaxially deposited silicon emitter layer. In some embodiments, the single crystal silicon solar cell structures may comprise moderately doped, thick (greater than 10 microns), epitaxially deposited FSF layers. The moderate doping reduces electron-hole recombination within the FSF and emitter layers and causes smaller bandgap narrowing and reduced Auger recombination compared to prior art devices which typically have more heavily doped layers, and the thicker FSF and emitter layers than typically used in prior art devices assist in having a desirable sheet resistance for the solar cell front and back surface, as measured prior to front side and back side metallization.

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Patent Owner(s)

Patent OwnerAddress
SVAGOS TECHNIK INC3050 CORONADO DRIVE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hao, Ruiying San Jose, US 14 2
Ravi, Tirunelveli S Saratoga, US 42 944

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