SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
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United States of America Patent
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Issued Date -
Jan 12, 2017
app pub date -
Jul 9, 2015
filing date -
Jul 9, 2015
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Abstract
The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second die pad, the first die pad coupled to a first portion of a metal layer, the second die pad coupled to a second portion of the metal layer, and the first portion of the metal layer and the second portion of the metal layer spaced apart by a second insulating layer. An associated semiconductor packaging method and another semiconductor package structure are also disclosed.
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