FLUX-ASSISTED DEVICE ENCAPSULATION

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United States of America Patent

SERIAL NO

14514838

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Abstract

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There are provided processes for encapsulating a device 14 on a substrate 12 utilizing a flux material 18. The incorporation of the flux material 18 substantially reduces oxide formation and porosity in the cladding 24 that encapsulates the encapsulated device 14.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS ENERGY INC4400 ALAFAYA TRAIL ORLANDO FL 32826

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bruck, Gerald J Oviedo, US 155 1528
Kamel, Ahmed Orlando, US 149 1465

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