ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20170006707A1
SERIAL NO

15058655

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Abstract

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An electronic device module and method thereof include a first device, a rewiring part, and second devices. The first device is mounted on a surface of a board. The rewiring part is formed along the surface of the board and a contour of the first device. The second devices are mounted on the rewiring part.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JEONG, Tae Sung Suwon-si, KR 42 540
PARK, No Il Suwon-si, KR 49 162
PARK, Seung Wook Suwon-si, KR 636 7943

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