ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170006707A1
SERIAL NO

15058655

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic device module and method thereof include a first device, a rewiring part, and second devices. The first device is mounted on a surface of a board. The rewiring part is formed along the surface of the board and a contour of the first device. The second devices are mounted on the rewiring part.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO 16674

International Classification(s)

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JEONG, Tae Sung Suwon-si, KR 42 540
PARK, No Il Suwon-si, KR 49 162
PARK, Seung Wook Suwon-si, KR 636 7943

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  • 1 Citation Count
  • H05K Class
  • 18.22 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges392138724467261388321101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0100200300400500600700800900100011001200130014001500

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