HEAT DISSIPATION DEVICE FOR ELECTRONIC SYSTEM
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United States of America Patent
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N/A
Issued Date -
Jan 5, 2017
app pub date -
Jun 30, 2015
filing date -
Jun 30, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic system includes an electronic component, a heat dissipation device coupled on the electronic component and a retaining device around the electronic component. The heat dissipation device includes a base configured to contact the electronic component and a plurality of fins extending from the base. The base includes a coupling face forming a plurality of screw threads thereon. The retaining device includes at least a coupling face. The coupling face of the retaining device forms a plurality of screw threads for engaging with the screw threads of the coupling face of the base.
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