LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Jan 5, 2017
app pub date -
Jan 8, 2016
filing date -
Jun 30, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A lead frame and a stack package module including the same are provided. The lead frame including a lower-end coupling portion coupled to a lower package through soldering, and an upper-end connecting portion contacting a side surface groove formed in a side surface of an upper package to support the upper package.
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