METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
Jul 11, 2016
filing date -
Jan 22, 2013
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Abandoned
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Abstract
A sample semiconductor device is manufactured and the curvature of the sample is measured. An area is set to be removed from an encapsulation resin layer on the basis of the measurement value. After forming the encapsulation resin layer during the process of manufacturing the semiconductor device, the removal area is removed.
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