PASSIVE PLACEMENT OF A LASER ON A PHOTONIC CHIP
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 5, 2017
app pub date -
Jul 2, 2015
filing date -
Jul 2, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
|
US Family Size
|
Non-US Coverage
|
Abstract
Embodiments disclosed herein generally relate to a method for manufacturing a photonic device that facilitates precise alignment of a laser with a waveguide. The method generally includes disposing the laser on a support member on a substrate such that the laser contacts the support member. The support member may extend in a direction perpendicular to a base plane of the substrate, and solder may be disposed on the base plane such that a height of the solder in the direction perpendicular to the base plane is less than a height of the support member so that a gap is created between the solder and the laser. Once the laser has been properly aligned with the waveguide, the solder may be heated (e.g., reflowed) so that the solder contacts the laser.
First Claim
Other Claims data not available