MODULES FOR HEAT EXCHANGE FOR USE IN COOLING TOWERS

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United States of America Patent

APP PUB NO 20170003087A1
SERIAL NO

14789198

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to modules for heat exchange for use in cooling towers and methods of assembling cooling towers using such modules. The aforementioned modules for heat exchange may include fill packing and a structural system configured to provide support for at least the fill packing, in which the structural system includes a plurality of structural members configured to provide compression and tension support. The aforementioned modules for heat exchange may be assembled prior to being transported to a job site and installed in a cooling tower.

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Patent Owner(s)

Patent OwnerAddress
SPX COOLING TECHNOLOGIES INC7401 WEST 129TH STREET OVERLAND PARK KS 66213

International Classification(s)

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  • 2015 Application Filing Year
  • F28F Class
  • 958 Applications Filed
  • 662 Patents Issued To-Date
  • 69.11 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JIANG, HONGJUN LEAWOOD, US 21 125
PISKURIC, ANDJELKO OVERLAND PARK, US 3 5

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  • 1 Citation Count
  • F28F Class
  • 24.01 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges912532554101 - 1011 - 2021 - 3031 - 4051 - 60020406080100120140160180200220240260280

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