ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN

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United States of America Patent

APP PUB NO 20170002242A1
SERIAL NO

15104273

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides an adhesive composition for a flexible printed wiring board containing (A) an epoxy resin; (B) no phosphorus-containing epoxy resin; and (C) a polyamide-imide resin.

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Patent Owner(s)

Patent OwnerAddress
TOYOBO CO LTDJAPAN OSAKA OSAKA CITY DOUSHIMA HAJI 2 CHOME NO 8 OSAKA-SHI OSAKA
NIPPON MEKTRON LTD1-12-15 SHIBA-DAIMON MINATO-KU TOKYO 105-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EBIHARA, Satoshi Tokyo, JP 5 253
HAMANO, Masami Shiga, JP 5 34
KOYANAGI, Hideyuki Shiga, JP 2 3
OBA, Hisae Tokyo, JP 3 3
OKANO, Kouji Tokyo, JP 4 18
YANE, Takehisa Shiga, JP 3 3

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