WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Dec 29, 2016
app pub date -
Jun 22, 2016
filing date -
Jun 24, 2015
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Abstract
A wiring board of the present disclosure includes an insulating layer and a wiring conductor. The wiring conductor is buried in an insulating layer in such a manner as to have a top surface exposed to a surface of the insulating layer. The wiring conductor includes, at a portion buried in the insulating layer, a wiring level difference part or a wiring inclined part having a width larger than a width of the top surface.
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