LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount

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United States of America Patent

SERIAL NO

15259266

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Abstract

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A light emitting device manufacturing method includes the following steps. A sub-mount, which has a plurality of electrical-conductive layers, is provided, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove. An LED chip, which has a bottom substrate, is mounted on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers. Glue is filled along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount.

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Patent Owner(s)

Patent OwnerAddress
LEXTAR ELECTRONICS CORPORATIONHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsia, Der-Ling New Taipei City, TW 6 36
Kuo, Cheng-Ta Hsinchu City, TW 32 199
Lee, Chia-En Chiayi City, TW 68 222

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  • 1 Citation Count
  • H01L Class
  • 13.47 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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