SEMICONDUCTOR WIRE BONDING AND METHOD

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United States of America Patent

APP PUB NO 20160379953A1
SERIAL NO

14749219

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Abstract

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Circuitry is disclosed that includes a first conductive portion of a first die and a first conductive pillar electrically and physically connected to the first conductive portion. The first conductive pillar includes a first conductive pillar surface. A first bond connects the first conductive pillar surface to a first end of a bond wire.

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Patent Owner(s)

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TEXAS INSTRUMENTS INCORPORATED12500 TI BOULEVARD M/S 3999 DALLAS TX 75243

International Classification(s)

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  • 2015 Application Filing Year
  • H01L Class
  • 25498 Applications Filed
  • 22451 Patents Issued To-Date
  • 88.06 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bonifield, Thomas D Dallas, US 53 774
Hsia, Ching-Lun Taoyuan City, TW 1 8
Hsu, Fu-Kang New Taipei City, TW 1 8
Thompson, Patrick Francis Wylie, US 17 18
West, Jeffrey Alan Dallas, US 58 465

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Patent Citation Ranking

  • 8 Citation Count
  • H01L Class
  • 13.47 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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