SEMICONDUCTOR WIRE BONDING AND METHOD
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United States of America Patent
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Issued Date -
Dec 29, 2016
app pub date -
Jun 24, 2015
filing date -
Jun 24, 2015
priority date (Note) -
Abandoned
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Abstract
Circuitry is disclosed that includes a first conductive portion of a first die and a first conductive pillar electrically and physically connected to the first conductive portion. The first conductive pillar includes a first conductive pillar surface. A first bond connects the first conductive pillar surface to a first end of a bond wire.
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