Heat isolation structures for high bandwidth interconnects
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United States of America Patent
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Jan 2, 2018
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Jul 2, 2014
filing date -
Jul 3, 2013
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Abstract
A die interconnect system having a plurality of connection pads, a heat generating element thermally isolated from the die, one or more leads extending from the die to the heat generating element, each lead having a metal core with a core diameter, a dielectric layer surrounding the metal core with a dielectric thickness, and an outer metal layer attached to ground, wherein one or more leads are exposed to ambient conditions and/or are convectively or contact cooled for at least a portion of their length to minimize heat transfer from the heat generating element to the die.
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