INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
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United States of America Patent
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Dec 29, 2016
app pub date -
Jun 25, 2015
filing date -
Jun 25, 2015
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Abstract
Insulating a via in a semiconductor substrate, including: applying a first dielectric layer to the semiconductor substrate; and applying a second dielectric layer to the semiconductor substrate, wherein the second dielectric layer is applied on the first dielectric layer, wherein the second dielectric layer is more conformal than the first dielectric layer.
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