PRINTED CIRCUIT BOARD
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United States of America Patent
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N/A
Issued Date -
Dec 22, 2016
app pub date -
Jan 21, 2016
filing date -
Jun 18, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed circuit board includes a core layer including a glass core, a first resin layer disposed on a first surface of the glass core, and a second resin layer formed on a second surface of the glass core; build-up layers disposed on the first and second surfaces of the core layer; and a conductive pattern formed in multiple layers on the build-up layers, wherein the core layer has asymmetric coefficients of thermal expansion opposing sides thereof with respect to a center of the glass core in a thickness direction.
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