METHOD FOR FORMING PAD OF WAFER
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United States of America Patent
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Issued Date -
Dec 22, 2016
app pub date -
Apr 30, 2014
filing date -
Jul 8, 2013
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Abstract
The present invention relates to a technology for simply performing a process of forming a pad on the rear surface of a via hole in a packing process in a process of forming a pad of a wafer. The present invention is characterized by a packing process in a process for manufacturing a wafer, the packing process comprising the steps of: attaching glass to the upper portion of a micro lens and then separating a handling wafer from an element wafer, thereby exposing metal layers formed on the element wafer to the outside; and forming pads for the metal layers.
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