SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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United States of America Patent
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Dec 22, 2016
app pub date -
May 24, 2016
filing date -
Jun 17, 2015
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Abstract
A semiconductor device includes: a board; a semiconductor chip that is not joined to the board; a wire whose one end is coupled with the semiconductor chip and whose other end is coupled with the board; and a first cover member that covers a first wire coupling portion in which the wire is coupled with the semiconductor chip.
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