Electronic device with periphery contact pads surrounding central contact pads
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United States of America Patent
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Jan 2, 2018
Issued Date -
N/A
app pub date -
Aug 30, 2016
filing date -
Nov 29, 2013
priority date (Note) -
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Abstract
An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.
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