PRINTED CIRCUIT BOARD HAVING AN OSCILLATION-DECOUPLED ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Dec 22, 2016
app pub date -
Jun 4, 2014
filing date -
Jun 25, 2013
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Abstract
The invention relates to an arrangement having a printed circuit board and having an oscillation-decoupled electronic component. According to the invention, the arrangement has a substructure in an oscillatable form. The substructure is connected to the printed circuit board on a surface region of the printed circuit board. The substructure has at least one holding plate for the component. The substructure is designed to decouple the component from structure-borne sound acting on the substructure from the printed circuit board. The substructure is in the form of a 3-dimensional moulded interconnect device structure that has at least one electrical connecting line, formed by an electrically conductive layer, that connects the printed circuit board to the component.
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