METHODS AND APPARATUS FOR PROCESSING TRANSPARENT MATERIALS
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United States of America Patent
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Jun 13, 2016
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Jun 16, 2015
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Abstract
A method for forming features in a substrate includes irradiating a substrate with a beam of laser pulses, wherein the laser pulses have a wavelength selected such that the beam of laser pulses is transmitted into an interior of the substrate through a first surface of the substrate. The beam of laser pulses is focused to form a beam waist at or near a second surface of the substrate, wherein the second surface is spaced apart from the first surface along a z-axis direction, and the beam waist is translated in a spiral pattern extending from the second surface of the substrate toward the first surface of the substrate. The beam of laser pulses is characterized by a pulse repetition rate in a range from 20 kHz to 3 MHz, a pulse duration, a pulse overlap, and a z-axis translation speed.
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