Wafer shipper with stacked support rings
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United States of America Patent
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Jan 19, 2021
Grant Date -
Dec 15, 2016
app pub date -
Feb 24, 2015
filing date -
Feb 25, 2014
priority date (Note) -
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Abstract
A wafer shipper utilizing wafer support rings for supporting individual wafers therein. The wafer support rings can support wafers of various thicknesses without affecting the height of the stack, and provide containment of the resident wafers within the rings during an impact event. The wafers and the rings cooperate to define voids between the wafers that act as cushions in an impact event for dampening the shock imparted on the wafers during an impact event. Likewise, some embodiments include structure that defines enclosed gas pockets between the uppermost and the lowermost wafers of the stack for dampening the effects of an impact. Various embodiments include structure that prevents wafers from “jumping” out of the wafer support rings during an impact event. Some embodiments include structure for supporting wafer flats.
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