SOLID-FILLED ENCAPSULATED LED BULB
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United States of America Patent
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app pub date -
Sep 3, 2015
filing date -
Jun 11, 2015
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Abandoned
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Abstract
A solid-filled encapsulated LED bulb with a base, at least one LED light source and at least one power supply element includes a transparent solid-filled heat-dissipating light guide member attached and covered onto the LED light source and the power supply element. A side of the heat-dissipating light guide member is packaged with the base to form the LED bulb. The heat of the LED light source is conducted and dissipated to the outside through the heat-dissipating light guide member. A light of the LED light source is outputted with an intensity IA through the heat-dissipating light guide member. The intensity IA of the light and the intensity IB of the LED light source satisfy the condition of (IA/IB)>70%. The use of a conventional dissipating structure is skipped to reduce the production cost and expedite the assembling and packaging processes while maintaining excellent heat dissipation and light output effects.
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