FILM-FORMING STRUCTURE ON WORK AND FILM-FORMING METHOD ON WORK

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United States of America Patent

APP PUB NO 20160362792A1
SERIAL NO

14820745

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Abstract

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A film-forming structure and a film-forming method on a work include closely depositing a thin primary film on a work, the primary film being a suboxide or an oxide including metal and is soft and has insulation properties and corrosion resistance. The primary film is porous film. The work is integrated with the primary film to prevent the primary film from peeling, and thereby improving the workability. The thin secondary film such as a coating is attached to the primary film closely, thereby reducing the amount of paint used. The primary film is integrated with the secondary film to prevent the secondary film from peeling, improving the workability after formation of the secondary film, and thereby forming the primary and secondary films rationally.

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Patent Owner(s)

Patent OwnerAddress
YOSHIDA HIDEO2-9-2 MATSUGAOKA TOKOROZAWA-SHI SAITAMA 359-1132

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SUYAMA, Yasuhiro Tokorozawa-shi, JP 4 5
YOSHIDA, Hideo Tokorozawa-shi, JP 223 1974

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