DYNAMIC HEAT CONDUCTION SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160360639A1
SERIAL NO

14733136

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This invention provides a dynamic heat conduction system comprising a base, a resilient unit, a heat conduction block, and at least one securing unit. The base accommodates the resilient unit and the heat conduction block and the at least one securing unit secures at least a portion of the base and the resilient unit within the base. The heat conduction block comprises a heat conduction surface for forming a contact with an electronic device and accomplishes preferably efficient heat conduction by conducting the heat produced by the electronic device through the heat conduction surface, the heat conduction block, and a side surface of the heat conduction block to the base. Still, this invention provides a dynamic heat conduction system comprising a heat conduction board for accommodating a plurality of heat conduction blocks and a plurality of bases for forming a preferable heat conduction path with a plurality of electronic devices having different shapes or sizes.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
ADVANTECH CO LTDTAIPEI 114

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HSIEH, Chi-Hung Taipei City, TW 4 3

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