METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOARD, AND ELECTRONIC DEVICE
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United States of America Patent
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app pub date -
Aug 17, 2016
filing date -
Nov 18, 2011
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Abandoned
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Abstract
There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered, the manufacturing. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat.
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