CIRCUIT SUBSTRATE AND ELECTRONIC EQUIPMENT INCLUDING THE SAME

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United States of America Patent

APP PUB NO 20160360609A1
SERIAL NO

15077711

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit substrate and an electronic equipment including the same are provided. The circuit substrate includes a build-up layer, a conductive pattern disposed on or within the build-up layer, a conductive via passing through the build-up layer and connected with the conductive pattern, and a dummy groove protruding into or passing through the build-up layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Chang-Bo Suwon-si, KR 3 24

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