METHOD FOR BONDING SUBSTRATES

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United States of America Patent

SERIAL NO

14917318

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Abstract

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A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP E THALLNER GMBHDI ERICH THALLNER STRASSE 1 ST FLORIAN AM INN A-4782

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FEHKUHRER, Andreas Senftenbach, AT 13 22

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