Method of mechanical separation for a double layer transfer
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United States of America Patent
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Feb 2, 2021
Grant Date -
Dec 8, 2016
app pub date -
Jun 1, 2016
filing date -
Jun 5, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a method for mechanically separating layers, in particular in a double layer transfer process. The present disclosure relates more in particular to a method for mechanically separating layers, comprising the steps of providing a semiconductor compound comprising a layer of a handle substrate and an active layer with a front main side and a back main side opposite the front main side, wherein the layer of the handle substrate is attached to the front main side of the active layer, then providing a layer of a carrier substrate onto the back main side of the active layer, and then initiating mechanical separation of the layer of the handle substrate, wherein the layer of the handle substrate and the layer of the carrier substrate are provided with a substantially symmetrical mechanical structure.
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