POLARIZATION STABILIZER ADDITIVE FOR ELECTROPLATING
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United States of America Patent
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Dec 8, 2016
app pub date -
Jun 5, 2015
filing date -
Jun 5, 2015
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Abstract
Provided herein are methods and apparatus for electroplating metal into recessed features. The techniques described herein utilize a polarization stabilizer compound to increase the stability of polarization at the substrate-electrolyte interface over time. Polarization stabilizers minimize changes in polarization to achieve improved plating results for a single substrate, and more uniform plating results over the course of several substrates. Furthermore, the polarization stabilizers discussed herein may be used to extend the lifetime of a particular electrolyte, thereby reducing manufacturing costs.
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