SYSTEMS AND METHODS FOR SEALING A PLURALITY OF RESERVOIRS OF A MICROCHIP ELEMENT WITH A SEALING GRID
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United States of America Patent
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Dec 8, 2016
app pub date -
Aug 19, 2016
filing date -
Aug 25, 2011
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Abstract
Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid are provided. For example, in one embodiment, a microchip element comprises a primary substrate having a plurality of reservoirs defined therein. The microchip element also includes a single continuous sealing groove defined in the primary substrate that extends around each of the plurality of reservoirs. In addition, the microchip element includes a sealing substrate comprising a single continuous sealing protrusion extending therefrom. The single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate. In this manner, the single continuous sealing groove and the single continuous sealing protrusion form a sealing grid about the plurality of reservoirs.
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