HYBRID COOLING FOR COMPUTER SYSTEMS
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United States of America Patent
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Issued Date -
Dec 1, 2016
app pub date -
May 27, 2015
filing date -
May 27, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In some implementations, a hybrid cooling apparatus can be used to cool computing components within a computing device. For example, the apparatus can comprise a plurality of conductors coupled at one end to a plurality of heat generating computing components. The plurality of conductors can be coupled at another end to a liquid cooling rack. The liquid cooling rack can comprise a radiator, and the plurality of conductors can be coupled to the liquid cooling rack at the radiator. The liquid cooling rack can be adapted to cycle cold liquid coolant through the radiator. Heat generated by the computing components is conducted through the conductors to the radiator and dissipated by the cold liquid coolant.
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