LASER ABLATION PROCESS FOR MANUFACTURING SUBMOUNTS FOR LASER DIODES AND LASER DIODE UNITS

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United States of America Patent

SERIAL NO

15237023

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Abstract

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A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.

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Patent Owner(s)

Patent OwnerAddress
IPG PHOTONICS CORPORATIONMARLBOROUGH MA 01752

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BERISHEV, Igor Holden, US 12 177
KOMISSAROV, Alexey Charlton, US 11 92
OVTCHINNIKOV, Alexander Worcester, US 5 12
TODOROV, Svletan Oxford, US 2 2
TRUBENKO, Pavel Northboro, US 4 10

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