PROCESS FOR MANUFACTURING INTEGRATED ELECTRONIC DEVICES, IN PARTICULAR CMOS DEVICES USING A BORDERLESS CONTACT TECHNIQUE
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United States of America Patent
Stats
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N/A
Issued Date -
Dec 1, 2016
app pub date -
Dec 11, 2015
filing date -
Dec 11, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
For manufacturing an integrated electronic device, a protection layer, of a first material, is formed over a body having a non-planar surface; a first dielectric layer, of a second material, is formed over the protection layer, the second material being selectively etchable with respect to the first material; an intermediate layer, of a third material, is formed over the first dielectric layer, the third material being selectively etchable with respect to the second material; a second dielectric layer, of a fourth material, is formed over the intermediate layer, the fourth material being selectively etchable with respect to the third material; vias are formed through the second dielectric layer, the intermediate layer, the first dielectric layer, and the protection layer; and electrical contacts, of conductive material, are formed in the vias.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
STMICROELECTRONICS S R L | VIA C OLIVETTI 2 AGRATE BRIANZA 20864 |
International Classification(s)

- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
MARIANI, Simone Dario | Vedano al Lambro, IT | 16 | 37 |
# of filed Patents : 16 Total Citations : 37 | |||
PAOLILLO, Sara | Milano, IT | 1 | 4 |
# of filed Patents : 1 Total Citations : 4 | |||
TAGLIABUE, Giovanni | Monza, IT | 7 | 157 |
# of filed Patents : 7 Total Citations : 157 |
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Patent Citation Ranking
- 4 Citation Count
- H01L Class
- 13.47 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 1, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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