SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
May 20, 2016
filing date -
May 28, 2015
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Abstract
In a semiconductor device, a first to a sixth switching elements are joined to a second main surface of a substrate with their electrode surfaces facing the second main surface of the substrate. Non-electrode surfaces of the switching elements are provided with respective heat spreaders joined thereto. Each of the heat spreaders is constituted of a heat spreader main body and a pair of standing portions. The heat spreader main body is formed in a cuboid having rectangular flat surfaces that are elongated in one direction. The standing portions are standing on both edges of a surface of the heat spreader main body.
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