Wiring thin plate with a wiring part and a protrusion having the same height, flexure as the wiring thin plate and method of welding of the wiring thin plate
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
May 31, 2016
filing date -
May 28, 2015
priority date (Note) -
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Abstract
Provided is a wiring thin plate capable of securely hold-down the wiring thin plate around a scheduled portion to be a welded spot even if the wiring thin plate is downsized and involves widened wiring traces. The wiring thin plate includes a metal supporting layer, an insulating layer on the supporting layer, a wiring part having a plurality of wiring traces on the insulating layer, a scheduled portion defined on the supporting layer to be welded, and a protrusion formed on the supporting layer for the scheduled portion and having a height that is the same as a height of the wiring part.
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