THICK ROUTING LINES IN DARK TRENCHES
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United States of America Patent
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Issued Date -
Dec 1, 2016
app pub date -
May 28, 2015
filing date -
May 28, 2015
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Abstract
Implementations described herein relate to display devices including a metal circuit layer embedded in a dielectric layer configured to provide optical properties. Trenches in the dielectric layer may be etched so that the thickness of the metal circuit layer may extend away from other circuit layers. In some implementations, the metal circuit layer can include thick metal routing lines to send data to pixels of the display device. The thick metal routing lines can provide high conductivity, minimal voltage drop, and signal speed that is sufficiently high to write data to many pixels over long distances. In some implementations, the dielectric layer can be configured to absorb light. Examples of such dielectric layers include carbon-doped spin-on-glass dielectric layers.
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